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RB11-H51/PDB-L59/5R
关键词:
RB11-H51/PDB-L59/5R
- 产品描述
-
特性
Features
峰值波长 940nm
Peak wavelength λp=940nm
低正向电压
Low forward voltage
产品符合无卤素
Pb free
产品通过 ROHS 认证
The product itself will remain within RoHS compliant version.
产品描述
Description
我司该产品将高灵敏光电器件完成贴片式封装,顶部封装胶体采用黑色透明树脂
RB11-H51/PDB-L59/5R is a high speed and high sensitive photodiode in miniature SMD package which is molded in a black epoxy with spherical top view lens.
The device is spectrally matched with silicon photodiode and phototransistor
应用
Applications
红外应用系统
Infrared applied system
高速光电探测器
High speed photo detector
复印机
Copier
游戏机
Game machine
红外应用系统
Infrared applied system
型号指南
Device Selection Guide
品名 Device No.
芯片材质 Chip Material
胶色 Lens Color
RB11-H51/PDB-L59/5R
Silicon
Black
绝对最大额定值(实验温度 25℃)
Absolute Maximum Ratings (Ta =25℃)
参数名称 Parameter
简写 Symbol
数值 Rating
单位 Unit
Reverse Voltage 反向电压
VR
32
V
Operating Temperature 工作温度
Topr
-40 ~ +85
℃
Storage Temperature 储存温度
Tstg
-40~ +100
℃
Soldering Temperature*1 焊接温度
Tsol
260
℃
Power Dissipation at(or below) 25℃ Free Air Temperature 25℃环境温度(或以下)功率
Pc
150
mW
Notes: *1:Soldering time≦5 seconds.
光电特性(测试温度 =25℃)
Electro-Optical Characteristics (Ta=25℃)
参数名称 Parameter
简写 Symbol
最小值 Min.
均值 Typ.
最大
值
Max.单位 Unit
测试条件 Condition
Rang Of Spectral Bandwidth 光谱带宽
λ
730
950
1100
nm
10% of λ P
Wavelength Of Peak Sensitivity 峰值波长
λP
938
940
942
nm
---
Short-Circuit Current 短路电流
ISC
--
3
--
μA
Ee =1mW /cm2
λ P =940nmReverse Light Current 光电流 VR =5V
IL
7.0
8.0
12.65
μA
Ee =1mW /cm2
λ P =940nmDark Reverse Current 暗电流
ID
0
1
80
nA
Ee =0mW /cm2
VR =10VReverse Breakdown Voltage 反向击穿电压
BVR
32
40
50
V
Ee =0mW /cm2
IR =100μATotal Capacitance 总电容 VR =3V
Ct
3
5
7
Ee =0mW/cm2
F =1MHzView Angle 角度
2θ1/2
80 95 100 deg VR =5V(X) 25 30 35 VR =5V(Y) 光电特性曲线
Typical Electro-Optical Characteristics Curves


封装尺寸
Package Dimensions

Notes:
1. 建议的焊盘仅供参考,请更具贵司需要进行调整
Suggested pad dimension is just for reference only. Please modify the pad dimension based on individual
need.
2. 所有尺寸均为毫米
All dimensions are in millimeters
3. 无特殊标识,尺寸公差±0.1mm
Tolerances unless dimensions ±0.1mm
标签规格
Label Form Specification

包装方式
Packing Procedure

卷装方式
Tapping:

Reel:5500pcs/reel 5500 颗/卷

Bag:5500pcs/Bag 5500 颗/包

可靠性实验项目和条件
Reliability Test Items and Conditions
产品可靠性符合项
The reliability of products shall be satisfied with items listed below.
置信水平:≥70%
Confidence level:70%
1
Reflow Soldering 回流焊
Temp. : 260℃/10sec.
6 Min.
22 PCS.
0/1
2
Thermal Shock 冷热冲击
H : +100℃ 5min ∫ 10 sec
L : -40℃ 5min300 Cycles
22 PCS.
0/1
3
High Temperature Life 高温寿命
Ta=85℃, IF = 20 mA
1000 Hrs.
22 PCS.
0/1
4
High Temperature/Humidity Reverse Bias 高温高湿
Ta=85℃,85%RH
1000 Hrs.
22 PCS.
0/1
5
Low Temperature Storage 低温储存
Ta=-40℃
1000 Hrs.
22 PCS.
0/1
6
High Temperature Storage 高温储存
Ta=100℃
1000 Hrs.
22 PCS.
0/1
7
DC Operation Life 寿命点亮
Ta=25℃, IF = 20 mA
1000 Hrs.
22 PCS.
0/1
8
Speed Up Life 常温加速寿命
Ta=25℃, IF = 50 mA
1000 Hrs.
22 PCS.
0/1
9
Air Tightness Experiment 气密性实验
红墨水温度 :80℃
80Min
22 PCS.
0/1
注意事项
Precautions For Use
1.过电流保护的用户必须使用电阻进行保护,否则轻微的电压漂移会引起大电流变化(烧坏)。
Over-current-proofCustomer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ).
2. 储存
Storage
2.1 在产品使用前不要打开防潮袋。
Do not open moisture proof bag before the products are ready to use.
2.2 在打开包装前,LED 应保持在 30℃以下&相对湿度 90%以下。
Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 发光二极管应在一年内使用。
The LEDs should be used within a year.
2.4 打开包装后,LED 应保持在 30 度以下&相对湿度 60%度以下。
After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less.
2.5 发光二极管应在打开包装后 168 小时(7 天)内使用。
The LEDs should be used within 168 hours (7 days) after opening the package.
2.6 如果吸湿材料(硅胶)已经褪色或 LED 已经超过使用时间,可进行烘烤处理应使用下列条件。
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.
烘烤处理:60±5℃ 烘烤 至少 24 小时
Baking treatment : 60±5℃ for Min. 24 hours.
3. 焊接条件
Soldering Condition
3.1 无铅焊料温度曲线
Pb-free solder temperature profile

3.2 回流焊不应超过两次。
Reflow soldering should not be done more than two times.
3.3 焊接过程中,不应在过程中的发光二极管。
When soldering, do not put stress on the LEDs during heating.
3.4 焊接完成后,不要扭曲电路板。
After soldering, do not warp the circuit board.
4. 烙铁
4. Soldering Iron
每个器件烙铁温度小于 350℃,同时,3 秒钟内一次烙铁容量小于 25W。然后离开两秒以上,再做下一个器件焊接。特别注意,因为产品的损坏通常是在手工焊锡的开始阶段。
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.
5.修复
Repairing
在 led 被焊接后不应进行修复。当不可避免的修理时,应该使用双头烙铁(如下图)。事先确定 LED 的特性是否会被修理损坏。
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

Notes
1.以上规格如有变更,恕不另行通知。瑞博将保留对上述材料的规格变更权。
Above specification may be changed without notice. RIBOR will reserveauthority onmaterial change for above specification.
2.当使用本产品时,请遵守绝对最大额定值和说明书中列出的使用说明。瑞博不负责因使用不符合这些规格说明书绝对最大额定值和指令包含的产品造成的任何损害承担。
When using this product, please observe the absolute maximum ratings and the instructionsfor using outlined in these specification sheets. RIBOR assumes no responsibility forany damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.
3. 此规格书为瑞博公司版权保护的材料。请不要擅自复制用于他处。
These specification sheets include materials protected under copyright of RIBOR corporation. Please don’t reproduce or cause anyone to reproduce them without RIBOR’s consent.
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